"Keystone technology on which to build!"
Conventional film coating processes are operated in wet media (solvent, water, solvent less organic liquids). NORCOP functionalizes film
surfaces exclusively in the gas phase in a reactive plasma in atmospheric pressure. According to the composition of the injected gas
mixture the following two plasmas are obtained.
Controlled Atmosphere Plasma
FILAMENTARY Electrical Discharge
Atmospheric Pressure -
Plasma Enhanced Chemical Vapor
GLOW Electrical Discharge
AP-CAP AP-CAP for Atmospheric Pressure - Controlled Atmosphere Plasma
AP-PECVD for Atmospheric Pressure-Plasma Enhanced Chemical Vapor Deposition
Atmospheric Pressure Atmosphere controlled Plasmas
Our technology is based on Dielectric Barrier Discharge (DBD) « Cold Plasmas »
The zone of the electrical discharge, which defines the “plasma reactor”, is located between the electrodes and the main drum of
the machine which is electrically earthed (counter electrode). The electrodes are surrounded by a housing which is protected from
the external atmosphere by two nitrogen knives, a first at the inlet and a second at the outlet of the housing, in the film running
direction and two static lateral barriers as well. The control of the atmosphere inside the housing is completed by an extraction fan
having a regulated flow rate, which allows to operate with a slightly positive pressure inside the housing. This set up prevents
external air from entering into the housing and enables the plasma to operate with a residual O 2 concentration lower than 50 ppm.
The residual oxygen concentration can be adjusted to specific values between 10 and 50 ppm according to the process
A second action of the nitrogen knives consists on removing the air boundary layer from the up side of the moving film and
replacing it with inert gas. This enhances atmosphere control in the plasma zone.
Electrode and injector design is made up from NORCOP engineers. It offers an excellent time-space distribution of injected gas
formulations, which lead to:
o High speed treatment levels varying from 20 to 300 m/min
o High growth rates of several µm/sec thickness at speeds ranging from 15 to 75 m/min
o Treated surfaces or thin layer deposition with very good homogeneity in both machine running and transversal directions